Round 1 - Fins, Lumped system heat transfer, How would fan curve look when fans are arranged in series and in parallel?, Why is there a bottle neck in thermal conductivity of the adhesive used between a chip and heat dissipation device? Round 2 - Explain what CFD is for a high school student, Stable and Consistent solutions, errors and residue, internal and external flows, mesh size and error , types of error.
Thermal Engineering Interview Questions
364 thermal engineering interview questions shared by candidates
Heat transfer and thermodynamics fundamentals
Do you have experience of handling multiple stakeholders? How do you handle deadlines? Why do you want this position?
Describe your engineering process
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