I applied through college or university. I interviewed at XYZ (Nāgpur, Maharashtra)
Interview
I interviewed at Siemens in July 2016.
Total there are three rounds aptitude,technical interview and HR interview
1. First round was aptitude test , it comprises of both technical and quantitative part.I cleared first round
2. Second round was technical interview in which they asked about my project ,they gave me some puzzles to solve and gave some program to write on paper , I can't clear that round .
Interview questions [1]
Question 1
Question. They asked to write method signature which return sorted array and number of element in array.
I applied through college or university. The process took 1 day. I interviewed at XYZ (Lonāvale) in Apr 2016
Interview
1) Group discussion
2) Personal Interview
3) Telephonic round
4) Verbal round
Results are out after this 4 rounds
This above process is for non technical customer support.
For technical support you should be on the top at telephonic round.
Interview questions [1]
Question 1
1) What is LAN WAN MAN?
2) What is memory fabrication?
-Unclear about duties and experience
-Nice people but didn't reach out to me until I reached out
-One guy was on the phone the entire time
-Offered coffee
-Had informational phone call after applying about a month before for a different position, easy communication in the beginning and kept in contact
Interview questions [1]
Question 1
What does your previous experience bring to this role?